制程能力about us
| 项目/Item | 类型/Description | 备注/Remark | |
|
层数 Layer |
软板/Flex board: 1-8Layers | ||
| 软硬结合/Flex-Rigid Board: 2-10Layers | |||
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材料 Material |
PI, PET, PEN, FR-4,透明PI,厚铜 | ||
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完成板厚 Final Thickness |
软板/Flex board: 0.002" - 0.1" (0.05-2.5mm) | ||
| 软硬结合/Flex-rigid board: 0.0024" - 0.16" (0.06-4.0mm) | |||
|
表面处理 Surface Treatment |
化学沉金,电镀镍金,沉银、沉锡,电厚金 Lead-free: ENG Gold; OSP, Immersion silver, Immersion Tin |
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最大/最小板尺寸 Max / Min Board Size |
最小/Min: 0.2"x0.3" 最大/Max: 20.5"x13" | ||
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最小线宽/线距 Min Trace Width / Min Clearance |
内层Inner | 外层Outer | |
| 1/3oz: 3/2mil | 1/3oz: 3/2mil | ||
| 1/2oz: 3/3mil | 1/2oz: 3/2mil | ||
| 1oz: 4/4mil | 1oz: 5/5mil | ||
| 2oz: 5/7mil | 2oz: 5/7mil | ||
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最小孔环 Min Hole Ring |
1/3oz-0.5oz: 4mil | 1/3oz-0.5oz: 4mil | |
| 1oz: 5mil | 1oz: 5mil | ||
| 2oz: 7mil | 2oz: 7mil | ||
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铜厚 Copper Thickness |
1/3oz - 2oz | ||
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最大/最小绝缘厚度 Max / Min Insulation Thickness |
2mil/0.5mil (50um/12.7um) | ||
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最小钻孔/公差 Min Hole Size and Tolerance |
Min hole: 4mil | ||
| Tolerance: PTH±3mil, NPTH±2mil | |||
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最小槽孔 Min Slot |
24mil x 35mil (0.6x0.9mm) | ||
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保护膜颜色 Coverlay color |
白色,黑色,黄色,透明 white,black,yellow,transparent |
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保护膜对位公差 Coverlay Alignment Tolerance |
±3mil | ||
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丝印对位公差 Silkscreen Alignment Tolerance |
±6mil | ||
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最小字符线宽 Silkscreen Line Width |
5mil | ||
| Gold Plating | Nickel: 80u" - 120u" | Gold: 1u"-15u" | |
| Immersion Nickel / Gold | Nickel: 80u" - 120u" | Gold: 1u"-3u" | |
| Immersion Silver | Silver: 6u" - 12u" | ||
| OSP | Film: 8u" - 20u" | ||
| 测试电压/Test Voltage | Testing Fixture: 50-300V | ||
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成型 Profile |
外形/Outline: ±0.05mm | ||
| 保护膜/Coverlay: ±0.2mm | |||
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